Resin molding die and production method for semiconductor devices using the same

ABSTRACT

A resin molding die includes: a cavity; a resin inlet through which a liquid resin to be cured is injected into the cavity; and an air vent through which air is released to an exterior space of the resin molding die during injection of the resin, the air vent being provided on an opposite side from the resin inlet with respect to the cavity.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a resin molding die for use inthe molding-based resin encapsulation of a semiconductor device, and aproduction method for semiconductor devices employing such a resinmolding die. In particular, the present invention relates to aproduction method for semiconductor devices employing a high-fluidityliquid thermosetting resin as an encapsulation resin, and a resinmolding die for use with such a production method.

[0003] 2. Description of the Related Art

[0004] Conventionally, resin encapsulation of semiconductor devices isachieved by: (1) casting molding, (2) transfer molding, or (3) injectionmolding.

[0005] (1) Casting molding. This technique involves: pouring a liquidthermosetting resin into a curing cast of PPS (polyphenylene sulfide),TPX (transparent plastic material for optics), or the like; mountingsemiconductor devices and inserting wire-bonded lead frames; and heatingthe complex in an oven.

[0006] (2) Transfer molding. Under this technique, a resin called “Bstage resin”, which results after the reaction of a thermosetting resinis interrupted halfway, is used. At molding, this resin is liquefied bythe application of heat and pressure, poured into a heated casting die,and then allowed to thermally cure.

[0007] (3) Injection molding. This technique chiefly employs athermoplastic resin as an encapsulation material. The encapsulationmaterial is liquefied under a high pressure, poured into a heatedcasting die, and then allowed to cool.

[0008] Conventionally, the injection molding technique has only employedthermoplastic resins. However, the development of liquid thermosettingresins which have an faster reaction rate has allowed an injectionmolding technique employing a liquid thermosetting resin.

[0009] However, the aforementioned conventional techniques have thefollowing problems.

[0010] (1) When the casting molding technique is used to mold an epoxyresin (a chief material which is currently used as an encapsulationresin), there is a problem in that the epoxy resin requires a longcuring time for a poly addition reaction to occur; this step bottlenecksthe production efficiency. Recently, radical reaction type resins whichrequire a relatively short curing time are also studied. However, sincethis type of resins exhibit a substantial sink due to cure-relatedshrinkage, such resins have not been put to practical use.

[0011] (2) Since the transfer molding technique uses a B stage resin,i.e., a resin which results after the reaction of a thermosetting resinis interrupted halfway, such a resin must be stored in a frozen state,adding to the transportation and storage costs. Such a resin alsorequires a long curing time for a polyaddition reaction to occur.

[0012] (3) When the injection molding technique is used forencapsulating a semiconductor device with a thermoplastic resin, thehigh resin injection pressure used may break the wires which are usedfor wire-bonding a semiconductor device and a lead frame. In order toprevent this problem, a method has been proposed (Japanese Publicationfor Opposition No. 4-40870) in which a low-pressure injection is firstperformed to produce resin for protecting the wires, and then the actualmolding of an external shape follows. However, the proposed techniquerequires some consideration in connection with a molding cycle time, andan increased number of molding dies must be used; therefore, thistechnique has yet to be introduced to actual mass production lines.Moreover, the high level of heat resistance and humidity resistancewhich is required for a semiconductor device encapsulation resin cannotbe expected from a transparent thermoplastic resin due to its resincharacteristics.

[0013] On the other hand, when the injection molding technique is usedfor encapsulating a semiconductor device with a liquid thermosettingresin, it is possible to protect wires by previously allowing a resin toadhere to the wires and curing the resin (called a “pre-dip curingtechnique”). However, according to this technique, the viscosity of theresin has been lowered due to the die heat when the resin is injected ata high injection pressure. As a result, the resin may leak from theparting faces of the molding die, allowing flashes to form.

SUMMARY OF THE INVENTION

[0014] A resin molding die according to the present invention includes:a cavity: a resin inlet through which a liquid resin to be cured isinjected into the cavity; and an air vent through which air is releasedto an exterior space of the resin molding die during injection of theresin, the air vent being provided on an opposite side from the resininlet with respect to the cavity.

[0015] In one embodiment of the invention, the resin is a thermosettingresin; and the air vent has an interspace of such dimensions that whenthe resin molding die is heated to or above a curing temperature of thethermosetting resin, air is allowed to be released to the exterior spaceof the resin molding die but that the resin cures and remains within theresin molding die.

[0016] In another embodiment of the invention, the air vent has aninterspace of such dimensions that the resin flows at a pressure whichis in the neighborhood of a pressure imposed by the weight of the resin.

[0017] In still another embodiment of the invention, the air vent has aninterspace of such dimensions that the resin being filled in the cavityexpels air to the air vent, and that the resin cures within the air ventwithout leaking into the exterior space of the resin molding die.

[0018] In still another embodiment of the invention, the resin is athermosetting resin; and at least a portion of the resin inlet is in anopen state when the resin molding die is heated to or above a curingtemperature of the thermosetting resin during injection of the resin.

[0019] A method for producing a semiconductor device according to thepresent invention includes the steps of: setting a semiconductor devicein a cavity of a resin molding die; injecting a thermosetting resin froma resin injection nozzle into the cavity, through a resin inlet of theresin molding die and a gate, at a pressure which is equal to or greaterthan a pressure imposed by the weight of the thermosetting resin andwhich is equal to or less than about 2 kg/cm²; and curing thethermosetting resin to encapsulate the semiconductor device within thethermosetting resin.

[0020] In one embodiment of the invention, the step of injecting thethermosetting resin includes lowering a viscosity of the thermosettingresin to about 3000 cps or less so that the thermosetting resin can passthrough the gate at a pressure which is equal to or greater than thepressure imposed by the weight of the thermosetting resin and which isequal to or less than about 2 kg/cm².

[0021] In another embodiment of the invention, the step of injecting thethermosetting resin includes injecting the thermosetting resin whileheating the resin molding die to or above a curing temperature of thethermosetting resin.

[0022] In still another embodiment of the invention, the step ofinjecting the thermosetting resin includes injecting the thermosettingresin while maintaining the resin molding die below a curing temperatureof the thermosetting resin; and the step of curing the thermosettingresin includes heating the resin molding die to or above the curingtemperature of the thermosetting resin.

[0023] In still another embodiment of the invention, the step ofinjecting the thermosetting resin includes providing a space between theresin inlet and the resin injection nozzle so as to ensure that theresin inlet is not closed off by the resin injection nozzle when theresin molding die is heated to or above a curing temperature of thethermosetting resin during injection of the resin.

[0024] In still another embodiment of the invention, the step ofinjecting the thermosetting resin includes cooling the resin injectionnozzle so as to be maintained at a temperature sufficiently below acuring temperature of the thermosetting resin.

[0025] In still another embodiment of the invention, the thermosettingresin is a resin which is obtained by adding a radical polymerizationinitiator or a cationic polymerization initiator to at least one maincomponent selected from the group consisting of: a liquid epoxy resin; aliquid vinyl ester resin; an allyl resin; and a low-viscosityunsaturated polyester resin.

[0026] In still another embodiment of the invention, the thermosettingresin is a transparent resin; and the semiconductor device is a lightreceiving/emitting device.

[0027] Epoxy resins, which have conventionally been used asthermosetting resins for semiconductor device encapsulation, require along curing time for a polyaddition reaction to occur. On the contrary,the present invention allows the use of a radical reaction-type resin ora cationic polymerization-type resin, so that the reaction time can besubstantially reduced. Such resins, which will not react unless acertain level of heat is applied thereto, do not need to be stored in afrozen state unlike the B-stage resins.

[0028] Such resins, when used for casting molding, may exhibit somesinking due to cure-related shrinkage. However, when such resins areused for injection molding, the continuous supply of resin prevents theoccurrence of sinking because any lack of resin is always compensatedfor. Thus, injection molding is suitable for the molding of arapid-curing resin. Yet, using a liquid thermosetting resin for theencapsulation of a semiconductor device still invites problems such asflash formation due to a high injection pressure.

[0029] Thus, the inventors conducted vigorous research to develop atechnique for injecting a liquid thermosetting resin into a molding dieat a low injection pressure, thereby arriving at the present invention.

[0030] Thus, the invention described herein makes possible theadvantages of (1) providing a resin molding die which enables low-costresin molding without allowing resin sink, wire breakage, or flashformation to occur; and (2) providing a production method forsemiconductor devices using such a resin molding die.

[0031] These and other advantages of the present invention will becomeapparent to those skilled in the art upon reading and understanding thefollowing detailed description with reference to the accompanyingfigures.

BRIEF DESCRIPTION OF THE DRAWINGS

[0032]FIGS. 1A and 1B are cross-sectional views showing a resin moldingdie and various components associated therewith, according to oneembodiment of the present invention. FIG. 1C is a plan viewcorresponding to FIGS. 1A and 1B.

[0033]FIGS. 2A and 2C are cross-sectional views showing a resin moldingdie and various components associated therewith, according to anotherembodiment of the present invention. FIG. 2B is a perspective viewillustrating a state occurring after resin has been injected into themolding die.

[0034]FIGS. 3A and 3B are cross-sectional views illustrating a processof injecting resin into a resin molding die according to one embodimentof the present invention.

[0035]FIGS. 4A, 4B, and 4C are cross-sectional views illustrating aprocess of injecting resin into a resin molding die according to oneembodiment of the present invention.

[0036]FIG. 5A is a plan view showing the relative positions of a spooland an air vent in a resin molding die according to yet anotherembodiment of the present invention. FIGS. 5B and 5C are cross-sectionalviews corresponding to FIG. 5A. FIG. 5D is a partially enlargedcross-sectional view corresponding to FIG. 5A. FIG. 5E is a partiallyenlarged perspective view corresponding to FIG. 5A.

[0037]FIGS. 6A, 6B, 6C, 6D, 6E, 6F, and 6G are cross-sectional viewsillustrating a method for producing a semiconductor device according tothe present invention.

[0038]FIG. 7 is a cross-sectional view illustrating an air ventaccording to the present invention.

[0039]FIG. 8 is a cross-sectional view illustrating the structure of anair vent in a resin molding die according to another embodiment of thepresent invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0040] Hereinafter, the principles of the present invention will bedescribed.

[0041] Examples of commonly used molding techniques include transfermolding, injection molding, and the like. These techniques require: (1)a very high clamping pressure (about 30 to about 40 tons); (2) a veryhigh injection pressure (about 1 ton with a tablet having about Φ 40mm); and (3) highly precise molding dies.

[0042] Epoxy resins, which are generally used as resin for encapsulatinga semiconductor device or the like, have a relatively slow reactionrate, and their cure time may span between about 5 and about 10 minutes(although it depends on the package size). Due to the slow cure rate ofsuch resins, in the presence of wide die openings (e.g., die partingfaces, air vents, or the like), there may be a lingering flow of resinuntil the completion of curing. The high injection pressure used alsoaggravates this problem.

[0043] Furthermore, the finishes of molding products may be largelydependent on the resin curing characteristics and the dimensions ofinternal features within the molding die (runners, gates, air vents,etc.). It is very difficult to optimize the molding conditions so as tomaintain a good balance between molding product formation and resinflash formation. In extreme cases, it may become necessary to modify thedie shape or even create a new molding die.

[0044] Although air vents are also employed in conventional moldingtechniques, their size is typically about 1 mm wide and about 0.01 mmdeep.

[0045] According to the present invention, an air vent is provided in aresin molding die for the molding processes, the air vent being situatedon the opposite side from a resin inlet with respect to a cavity. At thetime of resin injection, air is allowed to be released through the airvent to the exterior space of the molding die. As a result, it becomespossible to inject a resin into the molding die via low-pressureinjection (low pressure pouring or casting). Since a low-pressureinjection occurs, there is no need to perform an intense clamping forpreventing resin leakage outside the molding die (for preventing theformation of resin flashes at the parting faces). Therefore, a highlyprecise molding die is not a requirement, unlike under in conventionaltechniques. Thus, the production facility can be simplified, and the diemachining precision can be lowered to enable reduction in the overallcost.

[0046] The air vent may be obtained by providing a spool-like channel inthe molding die, as described in examples below, whereby an open systemis realized. Alternatively, the air vent may simply be an interspacebetween an upper die and a lower die.

[0047] In the case where the air vent is an interspace between an upperdie and a lower die, the interspace may be prescribed to be of suchdimensions that when the molding die is heated to or above the curingtemperature of a thermosetting resin, air is allowed to be releasedthrough the air vent to the exterior space of the molding die but thatthe resin cures before leaking out to the exterior space of the moldingdie. As a result, it becomes possible to inject a resin into the moldingdie via low-pressure injection. Even if the air vent is configured so asto have a larger cross-sectional area than that of an air vent used inconventional techniques, the dimension along the Z direction of the airvent may still be reduced (i.e., the distance between the upper andlower dies can be reduced), so that the resin will cure in a thermallyefficient manner. This may cause flashes to be formed outside thecavity. The flashes thus formed can prevent resin from leaking out tothe exterior space of the molding die after air is released through theair vent to the exterior space.

[0048] In the case where the air vent is a spool-like channel providedin the molding die, on the other hand, the size or diameter of such anair vent is preferably not made very large. An excessive large air ventof this type will incur a large amount of resin to be spent for the airvent, relative to that spent for the actual resin product. This maybottleneck the mold cure time of the overall mold, and result in anincrease in the amount of resin used (i.e., the amount of wasted resin).

[0049] Specifically, a spool-like air vent may be provided on theopposite side from a resin inlet with respect to a cavity, such that theinjected resin will flow at a pressure which is in the neighborhood of apressure imposed by its own weight (hereinafter referred to as“self-weight pressure”). The air vent serves as a passage for resin, sothat the injected resin flows, at a pressure which is in theneighborhood of a pressure imposed by its own weight, from the cavityinto the air vent. As a result, it is possible to inject a resin intothe molding die via low-pressure injection.

[0050] The air vent according to the present invention is sized largerthan air vents employed in conventional techniques. For example, arelatively large air vent and gate as shown in FIG. 7 may be provided,and a portion of the runner may be integrated with the product,according to the present invention.

[0051] The products shown herein are for illustrative purposes only, andnot in any way limitative. The present invention is applicable to a widerange of products. For example, light emitting diodes may be implementedas lead frame types (e.g., cannon ball-like configurations) or surfacemount types (e.g., substrate-like configurations), just to name a few.The runner, gate, and air vent may also be in different positions orshapes depending on the product shapes. In particular, in the case whereresin encapsulation is performed for a product having a substrate-likeconfiguration, a runner/gate, an air vent, and a product may be formedso as to have a cross-sectional shape as shown in FIG. 7, and theproduct portion may later be cut out for use.

[0052] The interspace constituted by the air vent may be prescribed tobe of such dimensions that when resin is filled in the cavity, airwithin the cavity is expelled to the air vent by the injected resin, butthat the resin cures within the air vent before leaking out to theexterior space of the molding die. For example, the air vent may have across-sectional area of about 0.2 mm² or more, although the specificdimensions of the air vent may depend on the desired packageconfiguration. As a result, it becomes possible to inject a resin intothe molding die via low-pressure injection while expelling air fromwithin the cavity to the air vent. Moreover, the resin can beefficiently cured within the air vent so as to form flashes therein,thereby preventing the resin from leaking out to the exterior space ofthe molding die.

[0053] The size of the air vent depends on the product configuration.FIG. 8 illustrates an air vent structure adapted to a given productconfiguration, where the air vent is an interspace between parting facesof the molding die. In one embodiment of the present invention, theresin which has flowed into the air vent ultimately forms flashes. Notethat conventional molding dies are sized so as to prevent flashes. Onthe other hand, the resin molding die according to the present inventionmay be sized so as to allow flash formation to occur therein. The reasonwhy the air vent may be sized so as to be larger according to thepresent invention than in conventional techniques while preventing resinfrom leaking out to the exterior space of the molding die is that thepresent invention employs a resin having a rapid cure rate.

[0054] The present invention provides no upper limit for the air ventsize.

[0055] In addition, the resin inlet may be sized so as to leave somespace between the inner wall of the resin inlet and a resin injectionnozzle which is used during the injection of resin, so that the resininlet is not closed off by the resin injection nozzle when the moldingdie is heated to or above the curing temperature of the thermosettingresin used. As a result, the air within the molding die is expelled bythe resin so as to be released through the inlet as well (i.e., throughthe space between the inner wall of the inlet and the resin injectionnozzle), thereby escaping to the exterior space of the molding die.Thus, it is possible to inject a resin into the molding die vialow-pressure injection.

[0056] Now, a method for encapsulating a semiconductor device using theaforementioned resin molding die will be described.

[0057] A liquid thermosetting resin is injected from a resin injectionnozzle, via a resin inlet of the molding die, through a gate, into acavity of the molding die at a pressure which is equal to or greaterthan the self-weight pressure and which is equal to or less than about 2kg/cm². The resin which is forced out into the cavity at such a lowpressure moves with a relatively slow injection rate, and thereforecures before moving out of the air vent and reaching the exterior spaceof the molding die. Thus, it is possible to prevent flash formationoutside the molding die. Furthermore, since the resin is injected intothe molding die at a relatively low pressure, there is no need toperform a pre-dip curing for preventing wire breakage, which is oneproblem associated with injection molding.

[0058] The viscosity of the resin used in the present invention ispreferably equal to or less than about 3000 cps, for example, in orderto ensure that the injected thermosetting resin can pass through thegate at a pressure which is equal to or greater than the self-weightpressure and which is equal to or less than about 2 kg/cm².

[0059] By constantly maintaining the molding die at temperatures whichare equal to or greater than the curing temperature of the thermosettingresin to be injected, it becomes unnecessary to rapidly heat or cool themolding die, thereby facilitating temperature control.

[0060] Alternatively, a resin may be injected after controlling the dietemperature to a temperature below the curing temperature of thethermosetting resin to be injected, and then increasing the dietemperature so as to be equal to or greater than the curing temperatureof the thermosetting resin, it becomes possible to stably inject a resininto a multitude of cavities from a single nozzle. In this case, it ispreferable to somewhat increase the viscosity of the resin to ensurethat the resin will not leak outside the molding die during resininjection. However, in embodiments where air is released through aninterspace between upper and lower dies (as described later), thenarrowness of the interspace allows a low-viscosity resin to be usedbecause the resin will quickly cure due to the good thermal efficiencyassociated with such a narrow interspace. Therefore, thin flashes may beallowed to form in the interspace and later removed.

[0061] Since the present invention chiefly employs injection moldingtechniques, although no limitation is intended, the amount of resin tobe injected may be predetermined and the resin may be measured up tothat amount each time before injection. The predetermined amount ofresin to be injected may be, for example, the design value for the inlet(spool)/runner/product+α (where α may be about 20% of the design value).Furthermore, if the inlet is not hermetically sealed, resin may flowback out of the inlet depending on factors such as the nozzle diameter,resin viscosity, etc., even if the injection is carried out above acertain pressure level.

[0062] It is preferable to leave some space between the resin injectionnozzle and the inner wall of the resin inlet, so that the resin inlet isnot closed off by the resin injection nozzle during resin injection whenthe molding die is heated to or above the curing temperature of thethermosetting resin used. As a result, the air within the molding die isexpelled by the resin so as to be released through the inlet as well(i.e., through the space between the inner wall of the inlet and theresin injection nozzle), thereby escaping to the exterior space of themolding die.

[0063] Furthermore, in order to ensure that resin will not cure withinthe resin injection nozzle after repetitive injections, it is preferableto cool the resin injection nozzle to a temperature which issufficiently lower than the curing temperature of the thermosettingresin used.

[0064] Examples of the thermosetting resin used in the present inventioninclude: (1) liquid epoxy resins such as glycidylether type resins,glycidylester type resins, glycidylamine type resins, linear aliphaticepoxides, and alicyclic epoxides; (2) liquid vinyl ester resins such asacrylic ester type or methacrylic ester type vinyl ester resins; (3)allyl resins such as polystyrene; and (4) low-viscosity unsaturatedpolyester resins. By employing a radical reaction-type resin or acationic polymerization-type resin which may be obtained by adding aradical polymerization initiator or a cationic polymerization initiatorto the above-listed resins, the reaction time can be substantiallyreduced. Such resins, which do not react unless a certain level of heator above is applied thereto, are convenient for storage andtransportation purposes.

[0065] By employing a transparent resin as such a thermosetting resin,it is possible to produce high-quality light receiving/emitting devicesat low costs.

[0066] Hereinafter, embodiments of the present invention will begenerally described first, followed by specific examples.

[0067] The following description will be directed to embodimentsemploying a liquid resin whose main component is a liquid vinyl esterresin of the composition shown in Table 1: TABLE 1 Component ratioProduct name Manufacturer (wt %) 3000M Kyoeisha Kagaku 40 Ltd. BP-2EMKyoeisha Kagaku 40 Ltd. benzylmethacrylate 5 organic peroxides 2 otheradditives 8

[0068] Alternatively, any other liquid thermosetting resin may be used,such as a liquid epoxy resin, a liquid vinyl ester resin, an allylresin, or a low-viscosity unsaturated polyester resin.

[0069]FIGS. 1A and 1B are cross-sectional views showing a resin moldingdie 100 and various components which are used in this illustrativeembodiment. FIG. 1C is a corresponding plan view. The resin molding die100 includes three parts: an upper right die 1 a, an upper left die 1 b,and a lower die 2.

[0070] A lead frame 20, which may be positioned relative to a lead framepositioning pin 21, is interposed between the upper right die 1 a andthe upper left die 1 b, and the upper right die 1 a and the upper leftdie 1 b are clamped together. Then, the upper right die 1 a and theupper left die 1 b, which may be together positioned relative to upperdie positioning pins 15, are clamped onto the lower die 2. Referencenumeral 22 denotes a lead frame tie bar.

[0071] The lower die 2 includes multiple cavities (products) 13. A resinwhich is injected from the resin inlet (spool) 11 provided in the upperleft die 1 b is injected, through a runner 14 and gates 13 a, into themultiple cavities 13.

[0072] Opposite from the resin inlet (spool) 11 with respect to thecavities 13, an air vent 12 which has a similar shape to that of thespool 11 is provided for allowing air to be released through the airvent 12 to the exterior space of the molding die. It will be appreciatedthat the position of the resin inlet 11 is not limited to the directopposite of the air vent 12 with respect to the cavities 13. As aresult, it becomes possible to inject a resin into the molding die vialow-pressure injection. The interspace (i.e., diameter in thisillustrative example) constituted by the air vent 12 is preferably madegreater than the diameter of the runner 14 for facilitating resin flow.An excessively large interspace constituted by the air vent 12 wouldresult in a waste of resin; however, this problem can be addressed bymeasuring a predetermined amount of resin at the time of injection.

[0073] In an alternative embodiment, as shown in FIG. 2A, an air ventslit 12 a may be provided on the opposite side from the spool 11 withrespect to the cavities 13. The interspace constituted by the air ventslit 12 a can be adjusted by controlling how close together an upper die1 a and a lower die 2 are clamped.

[0074] The interspace constituted by the air vent slit 12 a ispreferably of such dimensions that when the molding die is heated to orabove the curing temperature of the thermosetting resin used, air isallowed to be released through the air vent slit 12 a to the exteriorspace of the molding die, while the resin cures before leaking out tothe exterior space of the molding die. A good thermal efficiency can beobtained by using a narrow air vent slit 12 a, so that the resin willcure quickly. Therefore, a thin flash 34 a may be deliberately allowedto form at the air vent slit 12 a and removed later. Alternatively, aresin bin 12 b may be provided as shown in FIG. 2C in order to preventthe resin from leaking out to the exterior space of the molding die.

[0075] The preferable dimension range for the interspace constituted bythe air vent slit 12 a may vary depending on factors such as thereaction speed, surface energy, and the like of the resin. If thereaction speed of the resin is high, the resin can easily cure, so thatthe interspace constituted by the air vent slit 12 a may be increased.The interspace constituted by the air vent slit 12 a can also beincreased if the resin has a great surface energy. The interspaceconstituted by the air vent slit 12 a can be empirically determined. Forexample, if the resin has a gelation time of about 2 to 5 seconds on asubstrate which is heated to 150° C., an air vent slit 12 a having anarea of about 0.2 mm² will be adequate.

[0076] Furthermore, the spool 11 preferably has a greater diameter thanthat of a resin injection nozzle so as to leave some space between theresin injection nozzle and the inner wall of the spool 11 (so that theresin inlet is not closed off by the resin injection nozzle during resininjection) when the molding die is heated to or above the curingtemperature of the thermosetting resin used. The reasons for this aredescribed in detail below.

[0077] Referring to FIG. 3A, if no space is provided between the resininjection nozzle 30 and the spool 11, the nozzle 30 closes off the spool11, so that some air 40 may be left in the vicinity of the gate 13 a.The air 40 may be released by retracting the nozzle 30 as shown in FIG.3B. However, it is difficult to achieve low-pressure injection by firstinjecting the resin 31 while the spool 11 is closed off by the nozzle 30(as shown in FIG. 3A) and then retracting the nozzle 30 (as shown inFIG. 3B) because extra pressure will be applied during the resininjection.

[0078] On the contrary, by ensuring that there is a space 11 a betweenthe inner wall of the spool 11 and the resin injection nozzle 30 asshown in FIG. 4A, the resin will be elevated into the space 11 a betweenthe nozzle 30 and the inner wall of the spool 11, enabling low-pressureinjection. As a result, the resin 31 enters the cavity 31 as shown inFIGS. 4B and 4C. After injecting the resin 30, by retracting the nozzle30 before the resin 31 cures, the remaining air in the cavity 13 cantravel upward so as to be released through the space 11 a between thenozzle 30 and the inner wall of the spool 11. Since the spool 11 islikely to accommodate much more resin than in any interspace such as anair vent, the resin will not cure while filling the cavity or the spool.

[0079] By ensuring that the spool 11 is not closed off by the resininjection nozzle 30, i.e., so that the spool 11 is at least in apartially open state, there is an advantage in that air can beeffectively released from this portion. Furthermore, there is also anadditional advantage in that the resin injection occurs, rather than byvirtue of the injection pressure which is applied to the resin, but byvirtue of a pressure equivalent to a resin injection velocity resultingfrom the injection pressure plus the weight of the resin itself; as aresult, low-pressure molding can take place. This is because the openresin injection inlet allows the resin to flow back out of the inlet,even if the resin is injected above a certain pressure level.

[0080] The space 11 a can also be empirically determined. For example,if the resin has a gelation time of about 2 to 5 seconds on a substratewhich is heated to 150° C., a space 11 a having a width of about 1 mm toabout 2 mm will be adequate.

[0081] In order to achieve an efficient resin injection into multiplecavities, as shown in FIGS. 5A to 5C, the spool 11 is preferablyprovided in a central portion of the runner 14, and the air vents 12 arepreferably provided at both ends of the runner 14. In this case, asshown in FIGS. 5C to 5E, the resin which is injected from the centralspool 11 passes through the runner 14 so as to be injected into therespective cavities 13. As a result, air is released from the air vents12 at both ends.

[0082] Hereinafter, specific examples of the present invention will bedescribed, in which resin encapsulation is performed for an LED lamp byusing the liquid thermosetting resin and the resin molding die asdescribed above.

EXAMPLE 1

[0083] In Example 1 of the present invention, a case will be describedin which the temperature of the molding die is increased to or above thecuring temperature of the resin used.

[0084] First, as shown in FIG. 6A, a lead frame 20 for an LED lamp, towhich a semiconductor device has been mounted and wire-bonded, ispositioned relative to a lead frame positioning pin 21 provided in anupper right die 1 a. Then, an upper left die 1 b is attached, and theupper right die 1 a and the upper left die 1 b are clamped togetheralong the lateral direction. Then, the tip end of the lead frame 20 isinserted into a cavity 13 provided in a lower die 2, and the upper andlower dies 1 a, 1 b and 2 are clamped together along the verticaldirection. An air vent 12 having a similar shape to that of the spool 11is provided on the opposite side from the spool 11 with respect to thecavity 13. In Example 1 as well as Example 2 (described below), thespool 11 may have a diameter, e.g., Φ=about 5 mm, and the air vent 12may have a diameter, e.g., Φ=about 5 mm.

[0085] Next, as shown in FIG. 6B, a cylindrical resin injection nozzle30 is set to the spool 11 in such a manner that a space 11 a (e.g.,about 0 mm to about 2 mm) is provided between the resin injection nozzle30 and the inner wall of the spool 11 so that the resin injection nozzle30 will not close off the spool 11 even when the temperature of themolding die is increased to or above the curing temperature of thethermosetting resin used. However, the resin injection nozzle 30 maypartially be placed in close contact with the spool 11 so long as thereis a space between the inner wall of the spool 11 and the nozzle 30(that is, the portion between the inner wall of the spool 11 and thenozzle 30 is at least in a partially open state). In order to preventcuring of the resin within the resin injection nozzle 30, the tip end ofthe resin injection nozzle 30 is cooled so as to be maintained at atemperature in the range from about 60° C. to about 70° C., for example,i.e., below the curing temperature of the thermosetting resin. The dietemperature is set at about 130° C. to about 150° C.

[0086] The resin to be used is previously heated at a temperature belowthe curing temperature thereof (e.g., about 60° C.) so that theviscosity of the resin is lowered to about 3000 cps or less. As shown inFIG. 6C, the low-viscosity resin 31 thus obtained is injected from theresin injection nozzle 30, via the spool 11 and gates 13 a, into thecavities 13 at a pressure which is equal to or greater than theself-weight pressure and which is equal to or less than about 2 kg/cm².The resin injection nozzle 30 is cooled so as to be maintained at atemperature sufficiently below the curing temperature of thethermosetting resin.

[0087] After the resin injection, as shown in FIG. 6D, the resininjection nozzle 30 is removed from the molding die, and the injectedresin 31 is allowed to cure within the molding die.

[0088] After the resin has cured, as shown in FIG. 6E, the lower die 2is released, and a product 32 is taken out of the cavity 13. Then, asshown in FIG. 6F, the upper dies 1 a and 1 b are released, and a finalproduct (LED lamp) 33 is taken out.

[0089] Thereafter, as shown in FIG. 6G, the cured resin pieces 34 leftin the upper dies 1 a and 1 b are removed by means of extrusion pins 35or the like.

[0090] In accordance with the semiconductor device obtained asillustrated in the present example of the invention, the resin reactiontime is substantially reduced, and there is no need to store the resinin a frozen state. Therefore, the production cost can be reduced. Theuse of a thermosetting resin allows for high levels of heat resistanceand humidity resistance, which are prerequisites for a semiconductordevice encapsulation resin. Furthermore, no substantial sink due tocure-related shrinkage occurs, unlike in the case of casting molding.Moreover, flash formation is controlled, unlike in the case ofhigh-pressure injection molding. Thus, a high-quality semiconductordevice product can be obtained according to the present example of theinvention.

[0091] With a view to protecting the device and the associated wires,the lead frame for an LED lamp which is employed for the low pressureinjection molding according to the present example of the invention mayadditionally be subjected to a pre-dip curing process using the sameresin as the resin used for the actual molding, as in conventionalinjection molding (this also applies to Example 2 described later).Alternatively, in order to prevent void formation within the frame cup,only a pre-dip process may be performed while omitting pre-dip curing.

EXAMPLE 2

[0092] In Example 2 of the present invention, a case will be describedin which, in order to ensure stable resin injection from a single nozzleinto multiple cavities, the temperature of the molding die is firstlowered below the curing temperature of the resin used, and thereafterincreased to or above the curing temperature of the resin.

[0093] First, as shown in FIG. 6A, a lead frame 20 for an LED lamp, towhich a semiconductor device has been mounted and wire-bonded, ispositioned relative to a lead frame positioning pin 21 provided in anupper right die la. Then, an upper left die 1 b is attached, and theupper right die 1 a and the upper left die 1 b are clamped togetheralong the lateral direction. Then, the tip end of the lead frame 20 isinserted into a cavity 13 provided in a lower die 2, and the upper andlower dies 1 and 2 are clamped together along the vertical direction.

[0094] Next, as shown in FIG. 6B, a cylindrical resin injection nozzle30 is set to the spool 11. A space may or be provided between the resininjection nozzle 30 and the inner wall of the spool 11. Alternatively,the resin injection nozzle 30 may partially be placed in close contactwith the spool 11 so long as there is a space between the inner wall ofthe spool 11 and the nozzle 30.

[0095] The resin to be used is previously heated at a temperature belowthe curing temperature thereof (e.g., about 60° C.) so that theviscosity of the resin is lowered to about 3000 cps or less. As shown inFIG. 6C, the low-viscosity resin 31 thus obtained is injected from theresin injection nozzle 30, via the spool 11 and gates 13 a, into thecavities 13 at a pressure which is equal to or greater than theself-weight pressure and which is equal to or less than about 2 kg/cm².The resin molding die and the resin injection nozzle 30 are cooled so asto be maintained at a temperature sufficiently below the curingtemperature of the thermosetting resin. For example, the molding die ismaintained at about 80° C. to about 90° C., and the resin injectionnozzle 30 is maintained at about 60° C. to about 70° C.

[0096] After the resin injection, as shown in FIG. 6D, the resininjection nozzle 30 is removed from the molding die, and the dietemperature is increased to a temperature which is equal to or greaterthan the curing temperature of the resin (e.g., 130° C. to about 150°C.). Thus, the injected resin 31 is allowed to cure within the moldingdie.

[0097] After the resin has cured, as shown in FIG. 6E, the lower die 2is released, and a product 32 is taken out of the cavity 13. Then, asshown in FIG. 6F, the upper dies 1 a and 1 b are released, and a finalproduct (LED lamp) 33 is taken out.

[0098] Thereafter, as shown in FIG. 6G, the cured resin pieces 34 leftin the upper dies 1 a and 1 b are removed by means of extrusion pins 35or the like.

[0099] In accordance with the semiconductor device obtained asillustrated in the present example of the invention, the resin reactiontime is substantially reduced, and there is no need to store the resinin a frozen state. Therefore, the production cost can be reduced. Theuse of a thermosetting resin allows for high levels of heat resistanceand humidity resistance, which are prerequisites for a semiconductordevice encapsulation resin. Furthermore, no substantial sink due tocure-related shrinkage occurs, unlike in the case of casting molding.Moreover, flash formation is controlled, unlike in the case ofhigh-pressure injection molding. Thus, a high-quality semiconductordevice product can be obtained. In addition, resin can be stablyinjection from a single nozzle into multiple cavities, so thatproduction cycle time can be improved according to the present exampleof the invention.

[0100] As described above, according to the present invention, the resinreaction time can be substantially reduced, and there is no additionalcost incurred for the storage or transportation of the resin. Therefore,the cost for producing a semiconductor device according to the presentinvention can be reduced relative to conventional semiconductor deviceproduction processes. Furthermore, no substantial sink due tocure-related shrinkage or wire breakage associated with high injectionpressure occurs, and flash formation can be controlled. Furthermore,high levels of heat resistance and humidity resistance, which areprerequisites for a semiconductor device encapsulation resin, can beattained. In addition, it is possible to position a resin portion of asemiconductor device relative to a frame by using the resin molding dieaccording to the present invention, so that the product moldingprecision can be improved at a stably high level. Since low-pressuremolding is possible, the resin molding die according to the presentinvention can be produced at lower costs than molding dies for use withtransfer molding.

[0101] Various other modifications will be apparent to and can bereadily made by those skilled in the art without departing from thescope and spirit of this invention. Accordingly, it is not intended thatthe scope of the claims appended hereto be limited to the description asset forth herein, but rather that the claims be broadly construed.

What is claimed is:
 1. A resin molding die comprising: a cavity; a resininlet through which a liquid resin to be cured is injected into thecavity; and an air vent through which air is released to an exteriorspace of the resin molding die during injection of the resin, the airvent being provided on an opposite side from the resin inlet withrespect to the cavity.
 2. A resin molding die according to claim 1,wherein: the resin is a thermosetting resin; and the air vent has aninterspace of such dimensions that when the resin molding die is heatedto or above a curing temperature of the thermosetting resin, air isallowed to be released to the exterior space of the resin molding diebut that the resin cures and remains within the resin molding die.
 3. Aresin molding die according to claim 1, wherein the air vent has aninterspace of such dimensions that the resin flows at a pressure whichis in the neighborhood of a pressure imposed by the weight of the resin.4. A resin molding die according to claim 2, wherein the air vent has aninterspace of such dimensions that the resin being filled in the cavityexpels air to the air vent, and that the resin cures within the air ventwithout leaking into the exterior space of the resin molding die.
 5. Aresin molding die according to claim 1, wherein: the resin is athermosetting resin; and at least a portion of the resin inlet is in anopen state when the resin molding die is heated to or above a curingtemperature of the thermosetting resin during injection of the resin. 6.A method for producing a semiconductor device comprising the steps of:setting a semiconductor device in a cavity of a resin molding die;injecting a thermosetting resin from a resin injection nozzle into thecavity, through a resin inlet of the resin molding die and a gate, at apressure which is equal to or greater than a pressure imposed by theweight of the thermosetting resin and which is equal to or less thanabout 2 kg/cm²; and curing the thermosetting resin to encapsulate thesemiconductor device within the thermosetting resin.
 7. A methodaccording to claim 6, wherein the step of injecting the thermosettingresin comprises lowering a viscosity of the thermosetting resin to about3000 cps or less so that the thermosetting resin can pass through thegate at a pressure which is equal to or greater than the pressureimposed by the weight of the thermosetting resin and which is equal toor less than about 2 kg/cm².
 8. A method according to claim 6, whereinthe step of injecting the thermosetting resin comprises injecting thethermosetting resin while heating the resin molding die to or above acuring temperature of the thermosetting resin.
 9. A method according toclaim 6, wherein: the step of injecting the thermosetting resincomprises injecting the thermosetting resin while maintaining the resinmolding die below a curing temperature of the thermosetting resin; andthe step of curing the thermosetting resin comprises heating the resinmolding die to or above the curing temperature of the thermosettingresin.
 10. A method according to claim 6, wherein the step of injectingthe thermosetting resin comprises providing a space between the resininlet and the resin injection nozzle so as to ensure that the resininlet is not closed off by the resin injection nozzle when the resinmolding die is heated to or above a curing temperature of thethermosetting resin during injection of the resin.
 11. A methodaccording to claim 6, wherein the step of injecting the thermosettingresin comprises cooling the resin injection nozzle so as to bemaintained at a temperature sufficiently below a curing temperature ofthe thermosetting resin.
 12. A method according to claim 6, wherein thethermosetting resin is a resin which is obtained by adding a radicalpolymerization initiator or a cationic polymerization initiator to atleast one main component selected from the group consisting of: a liquidepoxy resin; a liquid vinyl ester resin; an allyl resin; and alow-viscosity unsaturated polyester resin.
 13. A method according toclaim 12, wherein: the thermosetting resin is a transparent resin; andthe semiconductor device is a light receiving/emitting device.